Laser-Perforated Copper Foil (12 µm, Li-ion Battery Anode)

High-purity laser-perforated copper foil (12 µm base, 6–8 µm through-holes) engineered as an advanced anode current collector for fast-charging and silicon-anode lithium-ion batteries. Custom hole patterns and sheet sizes available.

Products Specifications

A laser-perforated copper foil starts as a 12 µm (0.012 mm) high-purity electrodeposited copper foil (≥99.8% Cu) and is machined on a femtosecond/picosecond laser micro-drilling system into a uniform field of 6–8 µm through-holes. The cold-ablation process leaves burr-free hole edges and an almost zero heat-affected zone, so the foil keeps its tensile strength, conductivity and surface finish while gaining a precisely controlled open area.

Base materialCu ≥99.8%
Foil thickness12 µm (0.012 mm)
Hole diameter6–8 µm through-holes
PatternSquare / hexagonal
Sheet size100 × 100 mm
Tolerance±1 µm / ±2 µm

1Key Specifications

Because the perforations act as electrolyte transport channels and stress-relief paths, the foil works where solid collectors struggle: fast-charge cells, silicon/silicon-carbon composite anodes that swell during lithiation, and high-power cylindrical, prismatic or pouch designs.

ParameterValue
Base materialHigh-purity electrodeposited copper foil, ≥99.8% Cu
Foil thickness12 µm (0.012 mm); other gauges on request
Sheet size100 × 100 mm standard; custom sizes available
Hole diameter6–8 µm through-holes (uniform)
Hole arrangementSquare lattice standard; hexagonal lattice and custom pitch available
Diameter tolerance±1 µm
Positional accuracy±2 µm
ProcessFemtosecond/picosecond laser micro-drilling
Laser-perforated copper foil 12 µm with 6–8 µm through-holes for lithium-ion battery anode
Laser-perforated copper foil — uniform 6–8 µm micro-hole field, ±1 µm on diameter

The ultrashort-pulse laser removes material by cold ablation rather than melting, which is the difference that makes 12 µm and thinner foils processable at all. Hole-to-hole diameter variation is held within ±1 µm and positional accuracy within ±2 µm, reproduced sheet to sheet — the dimensional consistency large-format electrode manufacturing depends on.

2Key Features

Uniform 6–8 µm holes

Through-hole diameter held within ±1 µm and positional accuracy within ±2 µm, reproduced sheet to sheet by program-controlled laser drilling.

Faster wetting & Li-ion transport

The micro-pores shorten electrolyte diffusion paths, reducing concentration polarization at 4C–6C charge/discharge rates.

Silicon-anode compatible

The open structure absorbs the volume change of high-capacity silicon anodes, limiting delamination and slowing capacity fade over cycling.

Up to 40% lighter collector

Removing non-active copper cuts current-collector weight versus solid foil of equal thickness — a direct gain in gravimetric energy density.

Stronger coating bond

The pores give the active layer a mechanical interlock, lowering interfacial resistance between coating and collector.

Flexible & crack-resistant

Perforated foil conforms better during winding and stacking in cylindrical, prismatic and pouch formats.

Clean, reproducible process

Laser drilling — not mechanical punching or etching — keeps dimensional consistency critical for large-format electrode manufacturing.

3Applications

Micro-perforated copper foil for fast-charging and silicon-anode lithium-ion battery current collectors
Perforated collector architecture — engineered wetting and interfacial contact at electrode level
  • Anode current collector for fast-charging lithium-ion cells (4C–6C).
  • Current collector for silicon / silicon-carbon composite anodes in high-energy-density EV batteries.
  • High-power industrial energy-storage cells and cylindrical 4680-type formats.
  • Research and pilot-line evaluation of micro-perforated and 3D current collectors.

For semi-solid and solid-state electrode stacks, the perforated architecture is also used where wetting and interfacial contact need to be engineered at the collector level.

4FAQ

Does perforating the foil weaken it mechanically?

With ultrashort-pulse laser drilling the heat-affected zone stays minimal, so the remaining ligament structure keeps most of the base foil’s strength. Mechanical punching or chemical etching is far more damaging to thin foils; that is why laser micro-drilling is specified for 12 µm and thinner material.

What hole patterns can you make?

Square and hexagonal lattices are standard. Hole pitch, density and pattern are set by your electrode design and target open-area ratio; we adjust the drilling program and verify hole size with optical inspection before shipping.

Can you supply foil thinner than 12 µm?

Yes. 8–10 µm base foils can be processed with the same laser system, although handling and hole-tolerance requirements are tighter. Tell us the gauge, hole size and open-area target for a quote.

Is this foil suitable for solid-state battery research?

The perforated architecture is also used in semi-solid and solid-state electrode stacks where wetting and interfacial contact need to be engineered at the collector level. Contact us with your cell format for a recommendation.

Do you offer sample sheets for evaluation?

Yes. Small-batch evaluation sheets are available so your cell team can validate wetting, cycling and adhesion before committing to production quantities.

Request a quote for laser-perforated copper foil. TOPTITECHS supplies 12 µm (and 8–10 µm) laser-perforated copper foil with custom hole patterns, verified by optical inspection, from Baoji, China. Contact us with your gauge, hole size and open-area target for pricing and evaluation samples.

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